Print Email Facebook Twitter Thermal Analysis of Cu Pillars Title Thermal Analysis of Cu Pillars Author Desouza, Denver (TU Delft Electrical Engineering, Mathematics and Computer Science) Contributor Zhang, Kouchi (mentor) van Zeijl, H.W. (mentor) van den Berg, Rene (mentor) Thomassen, Nick (mentor) Degree granting institution Delft University of Technology Date 2021-06-30 Abstract THERMAL management is a very crucial step to ensure the reliability of Integrated Circuits (IC)s. The increase in power density has resulted in the formation of multiple, high-intensity, and non-uniform hotspots. This has not only affected the lifetime but also the performance of several devices. Optimization of the package design and layout are the methods investigated to solve this problem. In flip-chip packaging, each IC product varies with respect to power densities, die area, pin-count, laminate and PCB layers, etc. It is therefore important in understanding how the arrangement and geometry of each layer (in particular the interconnect layer) impacts the overall thermal management. To reference this document use: http://resolver.tudelft.nl/uuid:03abf581-a53e-44fc-a8c5-21a6921f82a3 Part of collection Student theses Document type master thesis Rights © 2021 Denver Desouza Files PDF TU_DELFT_Thesis_Report_Th ... illars.pdf 4.33 MB Close viewer /islandora/object/uuid:03abf581-a53e-44fc-a8c5-21a6921f82a3/datastream/OBJ/view