Print Email Facebook Twitter Substrate Transfer Technology for Stretchable Electronics Title Substrate Transfer Technology for Stretchable Electronics Author Joshi, S. (TU Delft Electronic Components, Technology and Materials; Philips Research) Savov, A.M. (TU Delft Electronic Components, Technology and Materials) Dekker, R. (TU Delft Electronic Components, Technology and Materials; Philips Research) Date 2016 Abstract This paper focuses on the implementation of a new technique for the fabrication of stretchable electronic patches that can be used for medical applications. The technique is based on the Electronics on Plastics by Laser Release (EPlaR) technology which enables a one-step release of a stack of flexible/stretchable layers incorporating the active layers like interconnects and embedded devices. As a proof of concept meander shaped polyimide (PI) structures are fabricated on top of a glass substrate and then transferred to a PDMS substrate with the use of this technology. The stretchability in the device is enhanced by fabricating these meander shaped structures free from the PDMS substrate hence giving them the freedom to move out of plane. Subject substrate transferflexiblestretchablebody patchesultrasound To reference this document use: http://resolver.tudelft.nl/uuid:17eb6a8e-1f71-495f-b32a-e5ebed25e948 DOI https://doi.org/10.1016/j.proeng.2016.11.459 ISSN 1877-7058 Source Procedia Engineering, 168, 1555-1558 Event Eurosensors 2016, 2016-09-04 → 2016-09-07, Budapest, Hungary Part of collection Institutional Repository Document type journal article Rights © 2016 S. Joshi, A.M. Savov, R. Dekker Files PDF 1_s2.0_S187770581633781X_main.pdf 261.85 KB Close viewer /islandora/object/uuid:17eb6a8e-1f71-495f-b32a-e5ebed25e948/datastream/OBJ/view