Print Email Facebook Twitter Ultra-Stretchable Interconnects for High-Density Stretchable Electronics Title Ultra-Stretchable Interconnects for High-Density Stretchable Electronics Author Shafqat, Salman (Eindhoven University of Technology) Hoefnagels, Johan P.M. (Eindhoven University of Technology) Savov, A.M. (TU Delft Electronic Components, Technology and Materials) Joshi, S. (TU Delft Electronic Components, Technology and Materials) Dekker, R. (TU Delft Electronic Components, Technology and Materials; Philips Research) Geers, Marc G.D. (Eindhoven University of Technology) Date 2017 Abstract The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS)-type) process recipes using bulk integrated circuit (IC) microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R) post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic) stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices. Subject Complementary metal-oxide semiconductor (CMOS) processingMechanical size-effectsMiniaturized interconnectsStretchable electronicsUltra-stretchability To reference this document use: http://resolver.tudelft.nl/uuid:3767b56d-2610-4e6c-b157-d2bdb2d811a5 DOI https://doi.org/10.3390/mi8090277 ISSN 2072-666X Source Micromachines, 8 (9) Part of collection Institutional Repository Document type journal article Rights © 2017 Salman Shafqat, Johan P.M. Hoefnagels, A.M. Savov, S. Joshi, R. Dekker, Marc G.D. Geers Files PDF 44919777_micromachines_08_00277.pdf 5.9 MB Close viewer /islandora/object/uuid:3767b56d-2610-4e6c-b157-d2bdb2d811a5/datastream/OBJ/view