Effect of temperature on fatigue crack growth in adhesive bonds

Title

Effect of temperature on fatigue crack growth in adhesive bonds

 Author

Usman, M.

Contributor

Alderliesten, R.C. (mentor)
Pascoe, J.A. (mentor)

Faculty

Aerospace Engineering

 Department

Aerospace Structures and Materials

 Date

2016-08-22

 Abstract

In this research effect of temperature on the disbond growth rate due to fatigue load in adhesive bonds is investigated. Concept of release of strain energy has been used. In particular the effect of temperature on the relationship between disbond growth rate and strain energy released per load cycle has been investigated. The general trend observed was the increase in disbond growth rate with the increase in temperature. This effect has been quantified and a simple model for the effect of temperature on the disbond growth rate has been developed using the concept of release of strain energy per cycle.

 Subject

fatigue crack growth rate
adhesive bonds
energy method
effect of temperature

 To reference this document use:

http://resolver.tudelft.nl/uuid:3ecee314-309b-4254-ab0f-34be7da90d9d

 Part of collection

Student theses

 Document type

master thesis

 Rights

(c) 2016 Usman, M.
Files
PDF Msc Thesis Muhammad Usman ... 381114.pdf 24.58 MB
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