Print Email Facebook Twitter Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications Title Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications Author Wang, Xinyue (Fudan University) Zeng, Zejun (Fudan University) Zhang, Jing (Heraeus Materials Technology) Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials) Liu, Pan (Fudan University) Contributor O'Conner, L. (editor) Date 2022 Abstract With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from high prices and electromigration. Therefore, a novel sintered material based on silver-copper core-shell structured particles raises the attention of researchers to solve this deficiency. To accelerate the development of new materials and their related processes, a four-sphere model of the silver-coated copper structure is established in this paper. The mathematical relationship between the porosity and thermal conductivity of sintered body and the actual sintering process was preliminarily established through the calculation based on a series of FEM simulations. The model was further validated through experiments. The modeling method and conclusion are utilized for future process adjustment, which is of great significance to accelerate the development, application, and reliability of new packaging materials. Subject die-attach materialpower electronic packagingsimulationCu@Ag particles To reference this document use: http://resolver.tudelft.nl/uuid:3f28f42e-96fa-4d82-bdef-883ad5e0ab89 DOI https://doi.org/10.1109/ECTC51906.2022.00086 Publisher IEEE, Piscataway Embargo date 2023-07-01 ISBN 978-1-6654-7944-8 Source Proceedings of the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Event 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022-05-31 → 2022-06-03, San Diego, United States Series Proceedings - Electronic Components and Technology Conference, 0569-5503, 2022-May Bibliographical note Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Part of collection Institutional Repository Document type conference paper Rights © 2022 Xinyue Wang, Zejun Zeng, Jing Zhang, Kouchi Zhang, Pan Liu Files PDF Simulation_and_Verificati ... ations.pdf 2.24 MB Close viewer /islandora/object/uuid:3f28f42e-96fa-4d82-bdef-883ad5e0ab89/datastream/OBJ/view