Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly

Title

Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly

 Author

Dekker, R.
Henneken, V.A.
Louwerse, M.C.
Raganato, M.F.

Faculty

Electrical Engineering, Mathematics and Computer Science

 Department

Microelectronics

 Date

2015-09-17

 Abstract

The present invention relates to an ultrasound transducer assembly (10), in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element (30) including an ultrasound transducer element (14) for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface (44), a bottom surface (46) and a side surface connecting the top surface and the bottom surface. An isolation layer (32, 50) forms the side surface for electrically isolating the substrate element.

 To reference this document use:

http://resolver.tudelft.nl/uuid:575286f9-9844-4f69-bf5b-521134ce138e

 Publisher

European Patent Office

 Source

http://worldwide.espacenet.com/publicationDetails/biblio?DB=EPODOC&II=35&ND=3&adjacent=true&locale=en_EP&FT=D&date=20150917&CC=WO&NR=2015135784A2&KC=A2

 Source

WO 2015135784 (A2)

 Part of collection

Institutional Repository

 Document type

patent

 Rights

(c) 2015 The Author(s)
Files
PDF WO2015135784A2.pdf 1.11 MB
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