Print Email Facebook Twitter A combined vertical interconnect/underfill process for high density I/O flip chip bonding Title A combined vertical interconnect/underfill process for high density I/O flip chip bonding Author jiao, weiping (TU Delft Electrical Engineering, Mathematics and Computer Science) Contributor Zhang, Kouchi (mentor) Ji, X. (graduation committee) van Zeijl, H.W. (graduation committee) Degree granting institution Delft University of Technology Programme Electrical Engineering | Microelectronics Date 2022-10-20 Abstract This thesis investigates the all-copper fine pitch bonding process with photoimageable underfill. NanoCU paste is used as interconnect material. A bi-layer photo resist structure is manufactured and lithographic stencil printing is used to apply nanoCu paste. A new underfill injection method is realized by using epoxy resin based photo resist as underfill layer. Adhesion of sample is extensively enhanced. Various bonding methods are developed including using AML bonder and Tresky pick-and-place bonder. Electrical measurements for sintered nanoCu interconnect are conducted, sheet resistance and contact resistance are studied. Subject all-copper interconnectphoto-patternable self-aligned underfillNanoCu paste sinteringphotolithographic stencil printing To reference this document use: http://resolver.tudelft.nl/uuid:6f2016c4-6642-411b-b80a-310f3f71a4ad Embargo date 2024-07-01 Part of collection Student theses Document type master thesis Rights © 2022 weiping jiao Files file embargo until 2024-07-01