Print Email Facebook Twitter Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage Title Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage Author Mimoun, B.A.Z. Pham, H.T.M. Henneken, V. Dekker, R. Faculty Electrical Engineering, Mathematics and Computer Science Department Microelectronics Date 2013-01-23 Abstract The authors have found that patterning polyimide coatings containing organosilane adhesion promoter using pure oxygen plasma resulted in a thin silicon-rich residue layer. They show in this paper that adding small amounts of fluorine-containing gas to the etching gas mixture is necessary in order to achieve residue-free polyimide plasma etching. They report residue-free plasma etching of polyimide coatings with both isotropic and anisotropic profiles, using either metal or oxide hard masks. These etching methods are however not sufficient for the fabrication of high density metal filled vias in 10??m thick polyimide coatings. In order to improve the metal step coverage over the vias while keeping the pitch as small as possible, the authors have developed a two-step etching recipe combining both isotropic and anisotropic profiles, resulting in wine-glass shaped vias. Subject adhesioncoatingsgas mixturespolymer filmssputter etching To reference this document use: http://resolver.tudelft.nl/uuid:70b4a840-5695-4a2c-9720-01ac5635ac06 Publisher American Vacuum Society ISSN 2166-2746 Source https://doi.org/10.1116/1.4788795 Source Journal of Vacuum Science & Technology B, 31 (2), 2013 Part of collection Institutional Repository Document type journal article Rights © 2013 American Vacuum Society Files PDF Mimoun_2013.pdf 1.74 MB Close viewer /islandora/object/uuid:70b4a840-5695-4a2c-9720-01ac5635ac06/datastream/OBJ/view