Print Email Facebook Twitter Transport of Ultra-Thin Chips Using a Micro-Conveyor Title Transport of Ultra-Thin Chips Using a Micro-Conveyor Author Stam, I.D. Contributor Tichem, M. (mentor) Faculty Mechanical, Maritime and Materials Engineering Department Precision and Microsystems Engineering Programme Micro and Nano Engineering Date 2015-09-28 Abstract In the thesis research discussed in this document, a concept that enables the conveying of ultra-thin chips without the presence of mechanical contact is discussed. The design is based on passive air cushion levitation and magnetic self-assembly. By means of angled nozzles, the ultra-thin chips are levitated and translated. Thereby, electromagnets are used to stop and hold the chips at certain desired locations. A nozzle pitch gradient is used to guide the ultra-thin chips. In addition to the design of the concept, the research focuses on the main physics corresponding to the concept to determine the theoretical system behaviour. By means of modelling steps the main physics were determined and by means of experiments the model results were evaluated. The measurement results show that the bending of the nozzle plate is relatively small in comparison with the chip levitation heights from the vertical airflow force test. In addition, the results show that the measurement set-up is able to lift the ultra-thin chips not only in the case when the electromagnet of the system is turned off, but also when it is turned on. The measurement results corresponding to the vertical airflow force test do, however, differ about 40% from the model results. Nevertheless, the shape of the trend-line corresponding to the measurement results from the vertical airflow force test with the pole piece tip located near the nozzle plate seems to correspond well with the shape of the trend-line corresponding to the matching model results. In addition, that is also the case for the trend-lines corresponding to the vertical magnetic force test results and three of the four model estimations sets. Finally, the chip rotation test results show that the rotation of the chip that is caused by the magnetic forces from the electromagnet is significant and shouldn't be neglected. Subject transportultra-thinchipsmicroconveyorairflowself-assemblyflexible electronics To reference this document use: http://resolver.tudelft.nl/uuid:80aad407-9ea4-4173-8611-fe7c4c851bee Part of collection Student theses Document type master thesis Rights (c) 2015 Stam, I.D. Files PDF Thesis.pdf 89.92 MB Close viewer /islandora/object/uuid:80aad407-9ea4-4173-8611-fe7c4c851bee/datastream/OBJ/view