Print Email Facebook Twitter In-Plane Displacement Detection With Picometer Accuracy on a Conventional Microscope Title In-Plane Displacement Detection With Picometer Accuracy on a Conventional Microscope Author Kokorian, J. Buja, F. Van Spengen, W.M. Faculty Mechanical, Maritime and Materials Engineering Department Precision and Microsystems Engineering Date 2014-07-17 Abstract In this paper, we present a new method for detecting in-plane displacements in microelectromechanical systems (MEMS) with an unprecedented sub-ångström accuracy. We use a curve-fitting method that is commonly employed in spectroscopy to find peak positions in a spectrum. We fit a function to the intensity profile of the image of a silicon beam that was captured with a CCD camera on an optical microscope. The position resolution depends on the amount of pixel noise and on how the moving feature is spread across the detector pixels. The resolution is usually limited by photon shot noise, which can be controlled and lowered in several ways. To demonstrate the technique we measure the adhesion snap-off of two silicon surfaces. We assess the accuracy of the technique using two different silicon MEMS devices and an experimental ultrananocrystalline diamond device. The lowest position noise that we report is obtained by summing 1,577 image lines and is as low as 60 pm root mean square. Subject displacement measurementMEMSoptical noiseoptical image processingoptical position measurementsubpixel resolution To reference this document use: http://resolver.tudelft.nl/uuid:8783bb66-5594-4fb2-a8f8-e4689c7707d7 DOI https://doi.org/10.1109/JMEMS.2014.2335153 Publisher IEEE ISSN 1057-7157 Source Journal of Microelectromechanical Systems, 24 (3), 2015 Part of collection Institutional Repository Document type journal article Rights © 2014 IEEE Files PDF Kokorian 2014.pdf 2.23 MB Close viewer /islandora/object/uuid:8783bb66-5594-4fb2-a8f8-e4689c7707d7/datastream/OBJ/view