Print Email Facebook Twitter System in package for intelligent lighting and sensing applications Title System in package for intelligent lighting and sensing applications Author Dong, M. (TU Delft Electronic Components, Technology and Materials) Contributor Zhang, Kouchi (copromotor) Degree granting institution Delft University of Technology Date 2016-09-19 Abstract As we enter era of “intelligence”, an increasing number of smart devices are being equipped around us. Such devices reflect the emerging need in microelectronics industry: increased functionality and miniaturization. As Moore’s law gradually meets its bottleneck, the concept of “More-than-Moore” (MtM) is proposed to address this issue by migrating board level system assembly to package level system integration. System in package (SiP) technology emerges as a promising solution for increasing the level of integration. Together with other novel packaging technologies, such as wafer level packaging (WLP), SiP shows great potential for providing intensely integrated functional system with miniaturized form factor. This thesis aims to develop novel SiP design and implement it into intelligent applications such as solid state lighting (SSL) and particulate matter (PM) sensor. Subject system in packageintelligent lightingparticulate matter sensor To reference this document use: https://doi.org/10.4233/uuid:b9a684b9-b75f-4b59-b623-37c977ae8b85 ISBN 978-94-028-0268-9 Part of collection Institutional Repository Document type doctoral thesis Rights © 2016 M. Dong Files PDF full_thesis_M_Dong.pdf 44.96 MB Close viewer /islandora/object/uuid:b9a684b9-b75f-4b59-b623-37c977ae8b85/datastream/OBJ/view