Print Email Facebook Twitter Self-encapsulation of epoxy resin by a controlled interface curing process in epoxy/water emulsion Part of: ICSHM 2013: Proceedings of the 4th International Conference on Self-Healing Materials· list the conference papers Title Self-encapsulation of epoxy resin by a controlled interface curing process in epoxy/water emulsion Author Zhu, G. Zhou, Y. Wu, Z. Tang, J. Dong, B. Han, N. Xing, F. Date 2013-06-16 Abstract The microcapsules of epoxy E-51 resin encapsulated by cured itself were prepared by interfacial curing reaction, in which ethylenediamine (EDA) was employed as curing agent and sulfonated copolymer of styrene and maleic anhydride (SMA) as emulsifying agent. Its found the morphology of microcapsules strongly depend on reaction time and EDA dosage. Usually, the microcapsules were formed in 20mins, Extension of the time doesnt change the morphology but thicken the shell and strengthen the microcapsules. Large dose of EDA bring about smooth surface of microcapsules. Its believed that this simple process to fabricate epoxy microcapsules is more suitable for the application of self healing concrete, because it is ease to be industrialized and can be produced in large scale. Subject microcapsuleepoxyself-healingemulsion To reference this document use: http://resolver.tudelft.nl/uuid:c26242ce-c011-4655-826d-fd37dbdc4cc0 Part of collection Conference proceedings Document type conference paper Rights (c) 2013 Zhu, G.; Zhou, Y.; Wu, Z.; Tang, J.; Dong, B.; Han, N.; Xing, F. Files PDF Zhu.pdf 671.26 KB Close viewer /islandora/object/uuid:c26242ce-c011-4655-826d-fd37dbdc4cc0/datastream/OBJ/view