Monolithic 3D Wafer Level Integration

Title

Monolithic 3D Wafer Level Integration: Applied for Smart LED Wafer Level Packaging

Author

Koladouz Esfahani, Z. (TU Delft Electronic Components, Technology and Materials)

Contributor

Zhang, Kouchi (promotor)
van Zeijl, H.W. (copromotor)

Degree granting institution

Delft University of Technology

Date

2017-01-19

Subject

System-in-Package
3D wafer-level integration
LED
high aspect ratio lithography
multi-step imaging
smart silicon interposer
side-wall photodiode
blue/UV selective photodetector
sensor readout
BiCMOS process
wafer-level optic
multidisciplinary simulation
optical simulation

To reference this document use:

https://doi.org/10.4233/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca

ISBN

978-94-028-0513-0

Embargo date

2019-01-19

Part of collection

Institutional Repository

Document type

doctoral thesis

Rights

© 2017 Z. Koladouz Esfahani