Charged particle single nanometre manufacturing

Charged particle single nanometre manufacturing

Prewett, Philip D. (Oxford Scientific Consultans, Oxford)
Hagen, C.W. (TU Delft ImPhys/Charged Particle Optics)
Lenk, Claudia (Ilmenau University of Technology)
Lenk, Steve (Ilmenau University of Technology)
Kaestner, Marcus (Ilmenau University of Technology)
Ivanov, Tzvetan (Ilmenau University of Technology)
Ahmad, Ahmad (Ilmenau University of Technology)
Robinson, A.J. (University of Birmingham)
Hari, S. (TU Delft ImPhys/Charged Particle Optics)
Scotuzzi, M. (TU Delft ImPhys/Charged Particle Optics)

2018

Following a brief historical summary of the way in which electron beam lithography developed out of the scanning electron microscope, three state-of-the-art charged-particle beam nanopatterning technologies are considered. All three have been the subject of a recently completed European Union Project entitled "Single Nanometre Manufacturing: Beyond CMOS". Scanning helium ion beam lithography has the advantages of virtually zero proximity effect, nanoscale patterning capability and high sensitivity in combination with a novel fullerene resist based on the sub-nanometre C₆₀ molecule. The shot noise-limited minimum linewidth achieved to date is 6 nm. The second technology, focused electron induced processing (FEBIP), uses a nozzle-dispensed precursor gas either to etch or to deposit patterns on the nanometre scale without the need for resist. The process has potential for high throughput enhancement using multiple electron beams and a system employing up to 196 beams is under development based on a commercial SEM platform. Among its potential applications is the manufacture of templates for nanoimprint lithography, NIL. This is also a target application for the third and final charged particle technology, viz. field emission electron scanning probe lithography, FE-eSPL. This has been developed out of scanning tunneling microscopy using lower-energy electrons (tens of electronvolts rather than the tens of kiloelectronvolts of the other techniques). It has the considerable advantage of being employed without the need for a vacuum system, in ambient air and is capable of sub-10 nm patterning using either developable resists or a self-developing mode applicable for many polymeric resists, which is preferred. Like FEBIP it is potentially capable of massive parallelization for applications requiring high throughput.

Charged particle beams
Electron
Field emission
Ion
Nanolithography

http://resolver.tudelft.nl/uuid:eadde9ea-7be1-4a72-a0e4-7ee6954032f3

https://doi.org/10.3762/bjnano.9.266

2190-4286

Beilstein Journal of Nanotechnology (online), 9 (1), 2855-2882

Institutional Repository

review

© 2018 Philip D. Prewett, C.W. Hagen, Claudia Lenk, Steve Lenk, Marcus Kaestner, Tzvetan Ivanov, Ahmad Ahmad, A.J. Robinson, S. Hari, M. Scotuzzi, More Authors