Print Email Facebook Twitter Foldable 3D Wafer Level SSL Package Using Flexible Interconnect Title Foldable 3D Wafer Level SSL Package Using Flexible Interconnect Author Sokolovskij, R. Contributor Zhang, G.Q. (mentor) Van Zeijl, H. (mentor) Liu, P. (mentor) Faculty Electrical Engineering, Mathematics and Computer Science Department Microelectronics & Computer Engineering Programme ECTM Electronic Components, Technology and Materials Date 2013-12-09 Abstract Solid State Lighting (SSL) is on track to replace conventional incandescent and fluorescent sources for general lighting. Even though it offers many benefits, the high initial device costs are still a major hindrance for many consumers. Packaging can account for up to half of the total device price, offering high potential for cost reduction. In this thesis, novel silicon wafer level packaging (WLP) concept and development platform are presented. The proposed packaging platform consists of silicon chips connected with neutral bending plane based flexible interconnect. Each chip contains an etched reflector cavity with wire bonded LED. The polyimide encapsulated flexible interconnects offer the benefit of folding the package into a 3D geometric shape. The space around the reflector cavity could be used to integrate active components and the backside { for passive components of the SSL driver circuit. The design, fabrication and characterization of the package is presented. A novel method to interconnect the front and backside of the chips is also incorporated into the process flow. After fabrication, packages are completed by adding LEDs, applying phosphor color conversion and release from substrate, followed by characterization of electrical, mechanical, thermal and optical performance. The developed packaging platform offers potential for future functional expansion by means of heterogeneous integration, possibly leading to a smart WLP package for SSL. Subject wafer level packagingWLPsolid state lightingSSLLEDintegrationmore than mooreflexiblepolyimideLED packageheterogeneous integration To reference this document use: http://resolver.tudelft.nl/uuid:f8ce5dcb-306e-4857-9671-31090c0536b4 Embargo date 2014-12-09 Part of collection Student theses Document type master thesis Rights (c) 2013 Sokolovskij, R. Files PDF thesis-sokolovskij-wlp.pdf 15.84 MB Close viewer /islandora/object/uuid:f8ce5dcb-306e-4857-9671-31090c0536b4/datastream/OBJ/view