Print Email Facebook Twitter A new hermetic sealing method for ceramic package using nanosilver sintering technology Title A new hermetic sealing method for ceramic package using nanosilver sintering technology Author Zhang, H. (TU Delft Electronic Components, Technology and Materials; Changzhou Institute of Technology Research for Solid State Lighting) Liu, Yang (Harbin University of Science and Technology) Wang, Lingen (Boschman Technologies) Fan, Jiajie (Hohai University; Beijing Research Center; Changzhou Institute of Technology Research for Solid State Lighting) Fan, Xuejun (Lamar University; Changzhou Institute of Technology Research for Solid State Lighting) Sun, Fenglian (Harbin University of Science and Technology) Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials; Changzhou Institute of Technology Research for Solid State Lighting) Date 2018 Abstract High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There are two kinds of lids used in this study, including copper lid and silicon lid. The X-ray and C-Mode Scanning Acoustic Microscopy (C-SAM) results revealed that delamination tended to happen in Cu lid sintered cavity as the recovery of deformed Cu lid was hindered by sintered dense Ag layer. However, no delamination or cracks were found in Si lid sintered cavity. Finite element analysis (FEA) method was used to investigate the effects of lid materials on the stress distribution of lid. The results indicated that the Cu lid sintered cavity showed a much higher stress than the Si lid sintered cavity under the sintering parameters of 250 °C and 10 MPa. There is no obvious change in the stress distribution areas on Cu lid with the increasing of pressures from 5 to 30 MPa. However, the distribution area of stress on Si lid expanded obviously only when the sintering pressure increased to 30 MPa. With the increase of sintering pressures from 5 to 30 MPa, the maximum stresses on Cu lid are almost the same, while increasing trend was found on Si lid. Subject Harsh environmentsNanosilverSinteredLidStress To reference this document use: http://resolver.tudelft.nl/uuid:fbae5c23-b48c-4b00-8e71-b21807c87dbf DOI https://doi.org/10.1016/j.microrel.2017.12.030 Embargo date 2020-01-04 ISSN 0026-2714 Source Microelectronics Reliability, 81, 143-149 Bibliographical note Accepted author manuscript Part of collection Institutional Repository Document type journal article Rights © 2018 H. Zhang, Yang Liu, Lingen Wang, Jiajie Fan, Xuejun Fan, Fenglian Sun, Kouchi Zhang Files PDF 1_45773067_A_new_hermetic ... nology.pdf 1.62 MB Close viewer /islandora/object/uuid:fbae5c23-b48c-4b00-8e71-b21807c87dbf/datastream/OBJ/view