Print Email Facebook Twitter Optimization of a plasma etching machine for failure analysis of semiconductors Title Optimization of a plasma etching machine for failure analysis of semiconductors Author Xu, Bingyan (TU Delft Electrical Engineering, Mathematics and Computer Science; TU Delft Electronic Components, Technology and Materials) Contributor Zhang, Kouchi (mentor) Dowling, K.M. (graduation committee) Tang, Jiaqi (graduation committee) Degree granting institution Delft University of Technology Programme Electrical Engineering Date 2023-09-21 Abstract Microwave Induced Plasma (MIP) is an advanced decapsulation tool developed by Jiaco Instruments. The goal of this thesis is to optimise the current MIP system. There are two directions: 1. Improve the etching rate. 2. Find selectivity between different materials (Si, SiO2, SiN). The experiments are divided into two parts in total, improved cavity and CF4-based MIP machine etching selectivity experiment. The cavity experimental results demonstrate that high input power is the route to optimising MIP efficiency. Etch experiments demonstrate that the CF4/O2 gas recipe is effective in achieving etch selectivity and that temperature is a key factor influencing these etch selectivities. Subject Microwave induced plasma(MIP)Afterglow plasma etchingBeenakker cavityEtching selectivityDecapsulationEtching recipe To reference this document use: http://resolver.tudelft.nl/uuid:63a4065b-e42b-47e9-85b2-f46b0f80eb42 Embargo date 2025-12-31 Part of collection Student theses Document type master thesis Rights © 2023 Bingyan Xu Files file embargo until 2025-12-31