Print Email Facebook Twitter Investigation on Viscoplastic Properties of Au-Sn Die-attach Solder Title Investigation on Viscoplastic Properties of Au-Sn Die-attach Solder Author Jin, Tianyi (TU Delft Electrical Engineering, Mathematics and Computer Science) Contributor Zhang, Guo Qi (mentor) Jansen, Kaspar (graduation committee) Poelma, Rene (graduation committee) de Langen, M.T.W. (graduation committee) Degree granting institution Delft University of Technology Programme Electrical Engineering Date 2017-10-24 Abstract Reliability is one of the major research topics of modern electronic packaging technology. The characterization of Au-Sn dia-attach solder material properties, including viscoplastic properties is requested for fast and accurate reliability assessment by industry. In this thesis, a detailed experimental based methodology to characterize Au-Sn solder's viscoplastic properties, including raw material introduction, test specimen preparation, shear creep experiments and test data analyze is provided. Furthermore, a study of microstructure effect on Au-Sn solder viscoplastic performance by experiments and following reliability analysis is presented. Subject Au-SnSolderReliabilityMicrostructureCooling rate To reference this document use: http://resolver.tudelft.nl/uuid:7bbb41c6-7e79-44fc-9901-377f739e2a0d Part of collection Student theses Document type master thesis Files PDF Delft_University_of_Techn ... _Copy_.pdf 9.78 MB Close viewer /islandora/object/uuid:7bbb41c6-7e79-44fc-9901-377f739e2a0d/datastream/OBJ/view