Print Email Facebook Twitter A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver Title A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver Author Sun, B. (TU Delft Electronic Components, Technology and Materials; State Key Laboratory of Solid State Lighting) Fan, Xuejun (Lamar University; State Key Laboratory of Solid State Lighting) Li, Lei (State Key Laboratory of Solid State Lighting) Ye, H. (Chongqing University) van Driel, W.D. (TU Delft Electronic Components, Technology and Materials; Philips Lighting Research) Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials; Chinese Academy of Sciences; State Key Laboratory of Solid State Lighting) Date 2017 Abstract This paper studies the interaction of catastrophic failure of the driver and LED luminous flux decay for an integrated LED lamp with an electrolytic capacitor-free LED driver. Electronic thermal simulations are utilized to obtain the lamp's dynamic history of temperature and current for two distinct operation modes: constant current mode (CCM) and constant light output (CLO) mode, respectively. Driver's mean time to failure (MTTF) and the LED's lifetime in terms of luminous flux are calculated. Under CLO mode, the LED's current increases exponentially to maintain the constant light output. As a result, the junction temperatures of LEDs, MOSFETs, and power diodes in driver rise significantly, leading to a much shorter MTTF and faster luminous flux depreciation. However, under the CCM, the junction temperatures of LEDs, MOSFETs, and diodes change modestly; therefore, the driver's MTTF and LED's luminous flux decay are not affected much by the variation of temperatures during LED's degradation process. Subject Catastrophic failureelectrolytic capacitor-free driverelectronic simulationfault treeLED lamplifetimereliabilitythermal simulation To reference this document use: http://resolver.tudelft.nl/uuid:e545569e-9516-4243-a8df-df1c06abe017 DOI https://doi.org/10.1109/TCPMT.2017.2698468 ISSN 2156-3950 Source IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (7), 1081-1088 Bibliographical note Accepted author manuscript Part of collection Institutional Repository Document type journal article Rights © 2017 B. Sun, Xuejun Fan, Lei Li, H. Ye, W.D. van Driel, Kouchi Zhang Files PDF 45809123_2017_CPMT.pdf 993.62 KB Close viewer /islandora/object/uuid:e545569e-9516-4243-a8df-df1c06abe017/datastream/OBJ/view